TR-3101-component low-temperature fast curing, low shrinkage, storage stability of one-component epoxy adhesive, mainly used in filling Magnets fixed, potting and bonding, chip packaging protection, camera. The one-component epoxy adhesive low shrinkage, can effectively prevent various Magnets crack, but also on a variety of materials have excellent adhesion effect. (Curing conditions 80 ℃, 15min) TR-124 is a development for CSP and BGA underfill (underfill). Its flow speed and heat fast curing. It provides for CSP and BGA solder joints superior protection against a variety of all kinds of mechanical stress, such as drops, shock and vibration. Thermal cycling can provide protection for SCP and BGA. Features: Low viscosity, room temperature flow; low-temperature fast curing; long working life. Widely used in circuit board assembly phones, tablet PCs, Bluetooth and other portable electronic products. (Curing conditions 80 ℃, 15min) TR-3152 is a low temperature curing one-component modified epoxy adhesive, fast curing, low shrinkage, high bond strength, good insulation, no corrosion of the substrate. Environmental pollution and has passed biocompatibility testing. The main application of the adhesive and medical devices. (Curing conditions 80 ℃, 20min)